By William Miller, for Eurasia Business News, June 14, 2025. Article no. 1557.
Huawei has publicly downplayed its chipmaking capabilities amid ongoing US-China technology tensions. According to Huawei CEO Ren Zhengfei, the company’s chips are currently about one generation behind those of their US counterparts, but Huawei is employing innovative approaches such as cluster computing and compound chip designs to enhance performance despite this gap.
Ren Zhengfei emphasized that Huawei is just one of many Chinese chip manufacturers and that the US has exaggerated Huawei’s achievements in AI chip technology.
Huawei is actively developing advanced AI chips, including the 910C model, which it plans to mass-ship soon in China. This chip integrates two 910B processors to double computational power and memory capacity, representing an architectural improvement rather than a revolutionary leap. The company is also building a 7nm AI chip production line and working towards 3nm chip development using alternative lithography techniques to circumvent US sanctions.
Despite these efforts, structural challenges persist in China’s semiconductor industry, and Huawei’s progress remains slower compared to global leaders like Nvidia, which continues to dominate the AI chip market. Huawei manages over 10 chip manufacturing plants in China, including facilities capable of producing 7nm and below-node chips, supported partly by the Chinese government but operated by Huawei.
While Huawei is advancing its chipmaking capabilities and striving for greater self-reliance amid US export restrictions, it acknowledges that its technology still lags behind US rivals and that its achievements are often overstated
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© Copyright 2025 – Eurasia Business News. Article no. 1556.
Eurasia Business News 